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집제품 센터커넥터, 상호 연결ic, 트랜지스터 용 소켓

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비교 그림 부분 # 제조사 기술 재고 사양서 RoHS 접점 마감 두께 - 포스트 작동 온도 실장 형 종료 유형 풍모 재질 난연성 등급 하우징 소재 피치 - 짝짓기 접점 마감 - 결합 접점 마감 두께 - 결합 연락처 마감 - 우편 연속 위치 개수 (그리드) 접촉 재료 - 결합 피치 - 포스트 소재 - 포스트 종단 게시물 길이 접촉 저항 현재 등급 (AMP) 기본 제품 번호 패키지 수량
8444-21B1-RK-TR 8444-21B1-RK-TR 3M CONN SOCKET PLCC 44POS TIN 유품11559 pcs 8444-21B1-RK-TR.pdf 160.0µin (4.06µm) -40°C ~ 105°C Surface Mount Solder PLCC Closed Frame UL94 V-0 Polybutylene Terephthalate (PBT), Glass Filled 0.050' (1.27mm) Tin 160.0µin (4.06µm) Tin 8400 44 (4 x 11) Copper Alloy 0.050' (1.27mm) Copper Alloy 0.132' (3.35mm) 15mOhm 1 A 8444 Tape & Reel (TR)
808-AG11D-ESL-LF 808-AG11D-ESL-LF TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 품절 808-AG11D-ESL-LF.pdf Flash -55°C ~ 105°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100' (2.54mm) Gold Flash Gold 800 8 (2 x 4) Beryllium Copper 0.100' (2.54mm) Copper 0.125' (3.18mm) 10mOhm - 808 Tube
299-87-310-10-001101 299-87-310-10-001101 Preci-Dip CONN IC DIP SOCKET 10POS GOLD 유품36964 pcs   - -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder DIP, 0.3' (7.62mm) Row Spacing Closed Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 299 10 (2 x 5) Beryllium Copper 0.100' (2.54mm) Brass 0.128' (3.24mm) 10mOhm 1 A 299-87 Tube
2-641260-1 2-641260-1 TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN 품절 2-641260-1.pdf - -55°C ~ 105°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Closed Frame UL94 V-0 Thermoplastic, Glass Filled 0.100' (2.54mm) Tin - Tin Diplomate DL 8 (2 x 4) Beryllium Copper 0.100' (2.54mm) Beryllium Copper 0.120' (3.05mm) 30mOhm - - Tube
540-44-052-17-400000 540-44-052-17-400000 Mill-Max Manufacturing Corp. CONN SOCKET PLCC 52POS TIN 품절 540-44-052-17-400000.pdf 150.0µin (3.81µm) -55°C ~ 125°C Surface Mount Solder PLCC Closed Frame UL94 V-0 Polyphenylene Sulfide (PPS) 0.050' (1.27mm) Tin 150.0µin (3.81µm) Tin 540 52 (4 x 13) Copper Alloy 0.050' (1.27mm) Copper Alloy - 20mOhm - 540-44 Tube
940-44-032-17-400000 940-44-032-17-400000 Mill-Max Manufacturing Corp. CONN SOCKET PLCC 32POS TIN 유품3186 pcs 940-44-032-17-400000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Surface Mount Solder PLCC Closed Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.050' (1.27mm) Tin 150.0µin (3.81µm) Tin 940 32 (2 x 7, 2 x 9) Beryllium Copper 0.050' (1.27mm) Brass Alloy - 30mOhm 1 A 940-44 Tube
214-99-632-01-670800 214-99-632-01-670800 Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 유품44379 pcs   200.0µin (5.08µm) -55°C ~ 125°C Surface Mount Solder DIP, 0.6' (15.24mm) Row Spacing Closed Frame - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100' (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 214 32 (2 x 16) Beryllium Copper 0.100' (2.54mm) Brass Alloy 0.056' (1.42mm) - 3 A 214-99 Tube
116-83-318-41-008101 116-83-318-41-008101 Preci-Dip CONN IC DIP SOCKET 18POS GOLD 유품38420 pcs   - -55°C ~ 125°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold 29.5µin (0.75µm) Tin 116 18 (2 x 9) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 116-83 Bulk
123-93-950-41-001000 123-93-950-41-001000 Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 유품38943 pcs   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Wire Wrap DIP, 0.9" (22.86mm) Row Spacing Open Frame - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 123 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.510" (12.95mm) - 3 A 123-93 Tube
612-93-320-41-001000 Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 유품49944 pcs   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.3' (7.62mm) Row Spacing Carrier, Open Frame - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100' (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 612 20 (2 x 10) Beryllium Copper 0.100' (2.54mm) Brass Alloy 0.124' (3.15mm) - 3 A 612-93 Tube
510-87-096-11-041101 Preci-Dip CONN SOCKET PGA 96POS GOLD 유품41478 pcs   - -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold Flash Tin 510 96 (11 x 11) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) 10mOhm 1 A 510-87 Bulk
522-93-101-13-061003 Mill-Max Manufacturing Corp. SKT PGA WRAPOST 품절   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Wire Wrap PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 522 101 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm 3 A 522-93 Bulk
24-8750-610C Aries Electronics CONN IC DIP SOCKET 24POS GOLD 유품31458 pcs 24-8750-610C.pdf 10.0µin (0.25µm) -55°C ~ 105°C Through Hole Solder DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) - 3 A 24-8750 Bulk
116-43-324-41-008000 Mill-Max Manufacturing Corp. CONN IC SKT DBL 유품29438 pcs 116-43-324-41-008000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 116 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.472" (11.99mm) 10mOhm 3 A 116-43 Tube
515-93-256-16-000003 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL 품절   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Closed Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 515 256 (16 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm 3 A 515-93 Bulk
0050395248 Molex 0050395248 품절   - - - - - - - - - - - - * - - - - - - - 005039 Bulk
522-13-100-13-061002 Mill-Max Manufacturing Corp. SKT PGA WRAPOST 품절 522-13-100-13-061002.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Wire Wrap PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 522 100 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm 3 A 522-13 Bulk
511-91-225-15-000001 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL 품절   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Closed Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 511 225 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-91 Bulk
02-0513-10H Aries Electronics CONN SOCKET SIP 2POS GOLD 유품48442 pcs 02-0513-10H.pdf 200.0µin (5.08µm) - Through Hole Solder SIP - UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Gold 10.0µin (0.25µm) Tin 0513 2 (1 x 2) Beryllium Copper 0.100' (2.54mm) Brass 0.125' (3.18mm) - 3 A 02-0513 Bulk
42-3574-11 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 유품45066 pcs 42-3574-11.pdf 200.0µin (5.08µm) - Through Hole Solder DIP, ZIF (ZIP), 0.3' (7.62mm) Row Spacing Closed Frame UL94 V-0 Polyphenylene Sulfide (PPS), Glass Filled 0.100' (2.54mm) Tin 200.0µin (5.08µm) Tin 57 42 (2 x 21) Beryllium Copper 0.100' (2.54mm) Beryllium Copper 0.110' (2.78mm) - 1 A 42-3574 Bulk
14-8870-310C Aries Electronics CONN IC DIP SOCKET 14POS GOLD 유품49888 pcs 14-8870-310C.pdf 10.0µin (0.25µm) -55°C ~ 105°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) - 3 A 14-8870 Bulk
26-81250-610C Aries Electronics CONN IC DIP SOCKET 26POS GOLD 유품44514 pcs 26-81250-610C.pdf 10.0µin (0.25µm) -55°C ~ 105°C Through Hole Solder DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 26 (2 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) - 3 A 26-8125 Bulk
523-93-156-15-061002 Mill-Max Manufacturing Corp. SKT PGA WRAPOST 품절   200.0µin (5.08µm) - Through Hole Wire Wrap PGA - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 523 156 (15 x 15) - 0.100" (2.54mm) - 0.510" (12.95mm) - - 523-93 Bulk
522-93-223-18-095003 Mill-Max Manufacturing Corp. SKT PGA WRAPOST 품절   200.0µin (5.08µm) - Through Hole Wire Wrap PGA - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 522 223 (18 x 18) - 0.100" (2.54mm) - 0.370" (9.40mm) - - 522-93 Bulk
116-41-310-41-003000 Mill-Max Manufacturing Corp. CONN IC SKT DBL 유품48519 pcs 116-41-310-41-003000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 116 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.315" (8.00mm) 10mOhm 3 A 116-41 Tube
14-81000-310C Aries Electronics CONN IC DIP SOCKET 14POS GOLD 유품31667 pcs 14-81000-310C.pdf 10.0µin (0.25µm) -55°C ~ 105°C Through Hole Solder DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) - 3 A 14-810 Bulk
614-43-950-31-012000 Mill-Max Manufacturing Corp. SKT CARRIER PGA 유품35330 pcs 614-43-950-31-012000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.9" (22.86mm) Row Spacing Carrier, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 614 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm 3 A 614-43 Tube
16-1508-20 Aries Electronics CONN IC DIP SOCKET 16POS GOLD 유품38481 pcs 16-1508-20.pdf 200.0µin (5.08µm) -55°C ~ 105°C Through Hole Wire Wrap DIP, 0.2' (5.08mm) Row Spacing Closed Frame UL94 V-0 Polyamide (PA46), Nylon 4/6 0.100' (2.54mm) Gold 10.0µin (0.25µm) Tin 508 16 (2 x 8) Beryllium Copper 0.100' (2.54mm) Brass 0.360' (9.14mm) - 3 A 16-1508 Bulk
523-13-241-18-075002 Mill-Max Manufacturing Corp. SKT PGA WRAPOST 품절 523-13-241-18-075002.pdf 10.0µin (0.25µm) - Through Hole Wire Wrap PGA - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 523 241 (18 x 18) - 0.100" (2.54mm) - 0.510" (12.95mm) - - 523-13 Bulk
510-13-168-17-105002 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL 유품44620 pcs 510-13-168-17-105002.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 510 168 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 510-13 Bulk
126-43-304-41-001000 Mill-Max Manufacturing Corp. CONN IC SKT DBL 유품28510 pcs 126-43-304-41-001000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Wire Wrap DIP, 0.3" (7.62mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 126 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.425" (10.80mm) 10mOhm 3 A 126-43 Tube
614-93-179-15-041001 Mill-Max Manufacturing Corp. SKT CARRIER PGA 품절   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Carrier, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 614 179 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm 3 A 614-93 Bulk
511-91-145-15-081001 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL 품절   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 511 145 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm 3 A 511-91 Bulk
551-90-100-10-000004 Mill-Max Manufacturing Corp. CONN HDR SOLDRTL 품절 551-90-100-10-000004.pdf 200.0µin (5.08µm) - Through Hole Solder PGA - - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 551 100 (10 x 10) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) - - 551-90 Bulk
1-1814655-7 TE Connectivity AMP Connectors CONN SOCKET SIP 28POS GOLD 품절 1-1814655-7.pdf 29.5µin (0.75µm) -55°C ~ 125°C Through Hole Solder SIP Closed Frame UL94 V-0 Thermoplastic, Polyester 0.100' (2.54mm) Gold 29.5µin (0.75µm) Gold - 28 (1 x 28) Beryllium Copper 0.100' (2.54mm) Brass 0.114' (2.90mm) 10mOhm 1 A 1814655 Bulk
116-43-652-61-007000 Mill-Max Manufacturing Corp. CONN IC SKT DBL 유품42281 pcs 116-43-652-61-007000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 116 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.402" (10.21mm) 10mOhm 3 A 116-43 Tube
114-83-632-41-134161 Preci-Dip CONN IC DIP SOCKET 32POS GOLD 유품46619 pcs   - -55°C ~ 125°C Surface Mount Solder DIP, 0.6' (15.24mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold 29.5µin (0.75µm) Tin 114 32 (2 x 16) Beryllium Copper 0.100' (2.54mm) Brass 0.047' (1.20mm) 10mOhm 1 A 114-83 Bulk
116-43-420-61-001000 Mill-Max Manufacturing Corp. CONN IC SKT DBL 유품39551 pcs 116-43-420-61-001000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 116 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.594" (15.09mm) 10mOhm 3 A 116-43 Tube
96-PRS14024-12 Aries Electronics CONN SOCKET PGA ZIF GOLD 유품32179 pcs 96-PRS14024-12.pdf 200.0µin (5.08µm) -65°C ~ 125°C Through Hole Solder PGA, ZIF (ZIP) Closed Frame UL94 V-0 Polyphenylene Sulfide (PPS) 0.100' (2.54mm) Gold 30.0µin (0.76µm) Tin PRS - Beryllium Copper 0.100' (2.54mm) Beryllium Copper 0.125' (3.18mm) - 1 A 96-PRS1 Bulk
510-13-154-13-021002 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL 유품30236 pcs 510-13-154-13-021002.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 510 154 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 510-13 Bulk
510-91-225-18-091002 Mill-Max Manufacturing Corp. SOCKET SOLDERTAIL 225-PGA 유품48672 pcs   - -55°C ~ 125°C Through Hole Solder PGA Open Frame - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) - - 225 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy - - - - -
26-7XXXX-10 Aries Electronics CONN SOCKET SIP 26POS TIN 품절 26-7XXXX-10.pdf 200.0µin (5.08µm) -55°C ~ 105°C Through Hole Solder SIP Elevated UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 700 Elevator Strip-Line™ 26 (1 x 26) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) - 1.5 A 26-7XXX Bulk
510-93-133-14-071002 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL 유품37314 pcs   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 510 133 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 510-93 Bulk
117-41-628-41-005000 Mill-Max Manufacturing Corp. CONN IC SKT DBL 유품41597 pcs 117-41-628-41-005000.pdf 200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder DIP, 0.6" (15.24mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 10.0µin (0.25µm) Tin 117 28 (2 x 14) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.125" (3.18mm) 10mOhm 3 A 117-41 Tube
88-PGM13028-10H Aries Electronics CONN SOCKET PGA GOLD 유품40142 pcs 88-PGM13028-10H.pdf 200.0µin (5.08µm) -55°C ~ 105°C Through Hole Solder PGA - UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 0.100' (2.54mm) Gold 10.0µin (0.25µm) Tin PGM - Beryllium Copper 0.100' (2.54mm) Brass 0.165' (4.19mm) - 3 A 88-PGM1 Bulk
124-83-312-41-002101 Preci-Dip CONN IC DIP SOCKET 12POS GOLD 유품43302 pcs   - -55°C ~ 125°C Through Hole Wire Wrap DIP, 0.3' (7.62mm) Row Spacing Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100' (2.54mm) Gold 29.5µin (0.75µm) Tin 124 12 (2 x 6) Beryllium Copper 0.100' (2.54mm) Brass 0.630' (16.00mm) 10mOhm 1 A 124-83 Bulk
42-6552-18 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 유품28555 pcs 42-6552-18.pdf 50.0µin (1.27µm) -55°C ~ 250°C Through Hole Solder DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame UL94 V-0 Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 55 42 (2 x 21) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) - 1 A 42-6552 Bulk
110-13-428-61-001000 Mill-Max Manufacturing Corp. CONN IC SKT DBL 유품38765 pcs 110-13-428-61-001000.pdf 10.0µin (0.25µm) -55°C ~ 125°C Through Hole Solder DIP, 0.4" (10.16mm) Row Spacing Open Frame - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 110 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) - 3 A 110-13 Tube
515-93-085-10-031001 Mill-Max Manufacturing Corp. SKT PGA SOLDRTL 품절   200.0µin (5.08µm) -55°C ~ 125°C Through Hole Solder PGA Open Frame UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 515 85 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm 3 A 515-93 Bulk
18-820-90TWR Aries Electronics CONN IC DIP SOCKET 18POS TIN 유품48715 pcs 18-820-90TWR.pdf 200.0µin (5.08µm) -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder DIP, 0.3' (7.62mm) Row Spacing Closed Frame UL94 V-0 Polyamide (PA46), Nylon 4/6 0.100' (2.54mm) Tin 200.0µin (5.08µm) Tin Vertisockets™ 800 18 (2 x 9) Phosphor Bronze 0.100' (2.54mm) Phosphor Bronze 0.145' (3.68mm) - 1.5 A 18-820 Bulk
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